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Datacon 2200 Evo Manual Rubicon Average ratng: 9,2/10 8831votes DATACON 2200 evo The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. More info on: DATACON 2200 evo plus The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. ESEC 2100 xP PLUS The Die Bonder Esec 2100 xP plus is the the 2 ndgeneration of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA.
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1.2 Code de la., 4e trimestre 1998. MOTO GUZZI SOUHAITE VOUS REMERCIER d'avoir choisi un de ses. Pdf Writer - Yung Nation All Gold Everything Free Mp3 Download - Ong Bak 2 Full Movie Download Hindi Dubbed - Pia Carrot E Youkoso Game Download - Contoh Proposal Seminar Kewirausahaan Pdf - Conduire Un Vehicle De Promenade Pdf Files. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.
FINEPLACER® femto 2 Automated sub-micron Die Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment.
Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production.
It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies. Highlights. Sub-micron placement accuracy. Handles ultra small to very large components. Fully-automated operation and assembly process. Supports wafer/substrate sizes up to 12″. Supports bonding forces up to 500 N.
Highly flexible platform architecture. Small footprint and compact design. Long-term stability. depending on configuration and application More info on.
Datacon 2200 evo hS. Innovative Solution for Innovative Products.
The Datacon 2200 evohS die bonder for Multi Module Attach assem- bles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full.Missing. There were no results for datacon apm 2200 die bonder training in any of the components on SMTnet. Suggestions: Make sure all words are spelled correctly.
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